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ADT 7200 Series- Full Automatic Dicing System

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The 7200 system offer a wide range of advanced automation and process monitoring options to meet the throughput & quality requirements of your most challenging dicing applications: Silicon, Glass on Silicon and GaAs wafers, BGA & QFN packages, LTCC, PCB and other hard material applications.

Specifications:


Features:

* unique WX3 wafer Handling System streamlines wafer flow for greater productivity
* Continuous Digital Magnification Vision System provides fast and accurate alignment of wafers for maximum throughput
* Special Algorithm predicts blade wear rates to reduce height measurement time and increase UPH
* Touch Panel Display supports a user-friendly graphical interface (GUI)
* Atomized Wafer Cleaning Technology for superior process results
* Dedicated Dressing Cassette enables automatic blade dressing
* Built-in inspection Tray allows in-process quality assessment
* Small footprint

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