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Dicing Saw Peripheral Equipment
Location:Home > Dicing Saw Peripheral Equipment
  • ADT 977 Wafer Clean Systems

    ADT 977 Wafer Cleaner System is designed for cleaning work pieces after dicing.The systems are offered in three basic configurations : WCS-977 – round wafer up to 8" WCS-977LA – round wafer up to ...

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  • ADT 967 Semi-Automatic Wafer Mounting System

    ADT 967 Semi-Automatic Wafer Mounting System is designed to automatically mount wafers on tape.

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  • ADT 966- Manual Wafer Mounter System

    ADT 966 Wafer Mounting Systems enable mounting of wafers/substrates to frames using various kinds of tapes.The systems are offered in two basic configurations: WM-966 – up to 8" wafer WM-966LA – up ...

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  • ADT UV 955

    ADT UV Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment. The systems are offered in two basic configurations: UV 955-8" – round wafer up...

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  • AE- Full Automatic Wafer Mounting System

    AE's AWM-8200 combines efficient material handling with advanced processing design to provide accurate, high-throughput mounting of wafers on dicing frames for dicing. Proper tape tensioning and bubbl...

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  • ADT 947 CO2 injector

    ADT Model 947- CO2 In-line Injector is a system that decreases the resistivity of deionized (DI) water to a predefined level, preventing damages associated with static discharge and particle adhesion ...

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